Marcin511
31 Maj 2013 16:00
#1
Cześć
Mam taką zagwostkę. Mam laptopa dv6-3040ew. Mam w nim dwie kości pamięci Samsung PC-10700 (667 MHz). Jednak pracują z prędkością 528 MHz. W biosie nie mam kompletnie nic, zero, mogę ustawić tylko bootowanie i zrobić jakiś selftest dysku. Z tego co widzę w CPU-Z to FSB jest ustawione na 132 MHz co daje nam 4*132 = 528 MHz pamięci. Ale pytanie czemu? Dawno temu wypadłem ze sprzętu. Mam procesor Intel® Core i5 CPU M 450 @ 2.40GHz. Czy to chipset, czy płyta spowalnia? czy procesor? I po co HP fabrycznie montuje szybsze pamięci które i tak nie będą wykorzystane? Wpinałem te pamięci do innego komputera i działały 667. Dodatkowo do mojego laptopa wpiąłem wolniejsze pamięci i działały one z prędkością 528 czyli tyle ile mogły wyciągnąć.
Kawałek raportu z CPU-Z
Processors Information ------------------------------------------------------------------------- Processor 1 ID = 0 Number of cores 2 (max 8) Number of threads 4 (max 16) Name Intel Core i5 450M Codename Arrandale Specification Intel® Core i5 CPU M 450 @ 2.40GHz Package (platform ID) Socket 989 rPGA (0x4) CPUID 6.5.5 Extended CPUID 6.25 Core Stepping K0 Technology 32 nm TDP Limit 25 Watts Core Speed 1321.4 MHz Multiplier x FSB 10.0 x 132.1 MHz Rated Bus speed 2378.6 MHz Stock frequency 2400 MHz Instructions sets MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, EM64T L1 Data cache 2 x 32 KBytes, 8-way set associative, 64-byte line size L1 Instruction cache 2 x 32 KBytes, 4-way set associative, 64-byte line size L2 cache 2 x 256 KBytes, 8-way set associative, 64-byte line size L3 cache 3 MBytes, 12-way set associative, 64-byte line size FID/VID Control yes Turbo Mode supported, enabled Max turbo frequency 2666 MHz Max non-turbo ratio 18x Max turbo ratio 20x Max efficiency ratio 9x TDC Limit 25 Amps Core TDP 25 Watts Uncore TDP 0 Watts Power @ 9x 3 Watts Power @ 10x 4 Watts Power @ 11x 5 Watts Power @ 12x 7 Watts Power @ 13x 9 Watts Power @ 14x 11 Watts Power @ 15x 14 Watts Power @ 16x 17 Watts Power @ 17x 21 Watts Power @ 18x 25 Watts Max bus number 127 Attached device PCI device at bus 127, device 2, function 1 Chipset ------------------------------------------------------------------------- Northbridge Intel Havendale/Clarkdale Host Bridge rev. 02 Southbridge Intel HM55 rev. 05 Memory Type DDR3 Memory Size 4096 MBytes Channels Dual, (Symmetric) Memory Frequency 528.6 MHz (4:16) CAS# latency (CL) 7.0 RAS# to CAS# delay (tRCD) 7 RAS# Precharge (tRP) 7 Cycle Time (tRAS) 20 Row Refresh Cycle Time (tRFC) 60 Command Rate (CR) 1T MCHBAR I/O Base address 0x0FED10000 MCHBAR I/O Size 4096 Memory SPD ------------------------------------------------------------------------- DIMM # 1 SMBus address 0x50 Memory type DDR3 Module format SO-DIMM Manufacturer (ID) Samsung (CE00000000000000) Size 2048 MBytes Max bandwidth PC3-10700 (667 MHz) Part number M471B5673FH0-CH9 Serial number 8212E7D9 Manufacturing date Week 18/Year 10 Number of banks 8 Nominal Voltage 1.50 Volts EPP no XMP no AMP no JEDEC timings table CL-tRCD-tRP-tRAS-tRC @ frequency JEDEC #1 5.0-5-5-14-19 @ 380 MHz JEDEC #2 6.0-6-6-17-23 @ 457 MHz JEDEC #3 7.0-7-7-20-27 @ 533 MHz JEDEC #4 8.0-8-8-22-30 @ 609 MHz JEDEC #5 9.0-9-9-25-34 @ 685 MHz DIMM # 2 SMBus address 0x52 Memory type DDR3 Module format SO-DIMM Manufacturer (ID) Samsung (CE00000000000000) Size 2048 MBytes Max bandwidth PC3-10700 (667 MHz) Part number M471B5673FH0-CH9 Serial number 8212E7F3 Manufacturing date Week 18/Year 10 Number of banks 8 Nominal Voltage 1.50 Volts EPP no XMP no AMP no JEDEC timings table CL-tRCD-tRP-tRAS-tRC @ frequency JEDEC #1 5.0-5-5-14-19 @ 380 MHz JEDEC #2 6.0-6-6-17-23 @ 457 MHz JEDEC #3 7.0-7-7-20-27 @ 533 MHz JEDEC #4 8.0-8-8-22-30 @ 609 MHz JEDEC #5 9.0-9-9-25-34 @ 685 MHz